AMD and LSI Among the Latest Technology Partners

BOISE, Idaho, June 12, 2012 (GLOBE NEWSWIRE) -- Micron Technology, Inc.
(Nasdaq:MU), one of the world's leading providers of advanced
semiconductor solutions, today introduced a new class of 1GHz,
2-gigabit (Gb) and 4Gb, 30-nanometer (nm) DDR3 devices, strengthening
the company's comprehensive DDR3 portfolio. Designed for the high-
performance networking and discrete graphics markets, the new devices
feature industry-leading low power use while delivering speeds up to
2133 megatransfers per second (MT/s).

Micron supports its customers in highly competitive market segments
with a broad portfolio of DRAM and nonvolatile memory devices that meet
the demand for high-performance, cost-efficient memory solutions.
"Micron has been successful in creating a complete DRAM portfolio, and
this product offering rounds out the broadest DRAM offering in the
industry," said Mike Howard, senior principal analyst, DRAM and Memory
at iSuppli.

Optimized for the demanding, performance-driven discrete graphics and
high-speed networking markets, the new DDR3 devices provide the latest
SoCs/GPUs with ever-increasing bandwidth required for this space.
Industry-leading suppliers AMD and LSI are among the latest technology
and IP partners for these products, both having worked closely with
Micron throughout the development process. Micron relies on its
ecosystem partnerships to deliver greater product reliability and
compatibility, which, in turn, optimizes customers' time to market and
design costs.

"Massive data growth continues to tax storage and networking equipment,
and contending with that growth requires high-performance memory
interfaces to meet system bandwidth requirements," said Harold Gomard,
SerDes and DDR IP Product Manager, LSI. "Micron's broad memory product
line and support for 1GHz DDR3 memory in 2 and 4Gb-based modules
enables LSI to meet the needs of enterprise and cloud networking and
storage customers."

"We continue to build an aggressive portfolio for the
performance-focused graphics market," said Matt Skynner, corporate vice
president and general manager, AMD Graphics. "With Micron's new DDR3
devices we expect to drive even more performance."

In addition to components that satisfy both the discrete graphics and
networking segments, Micron will offer 2133 megatransfers per second
(MT/s) module form factors, including networking-specific ECC UDIMMs.

"High-speed DDR3 will be powering the mainstream graphics and
high-performance networking markets in 2012 and beyond. Micron is
prepared to support these demanding markets by leveraging our expertise
with high-volume, cost-efficient DDR3 products and developing these
very high-performance DDR3 devices," said Robert Feurle, vice president
of DRAM marketing for Micron. "The combination of our advanced process
technology and our commitment to the graphics and high-end computing
markets has proven highly successful, and these new 30nm 2Gb and 4Gb
DDR3 products will continue to deliver on that promise."

Samples of Micron's new class of high-performance, low-power DDR3
devices are available now, with volume production ramping by summer.
For more information, please visit www.micron.com.

Micron Technology, Inc., is one of the world's leading providers of
advanced semiconductor solutions. Through its worldwide operations,
Micron manufactures and markets a full range of SSDs, DRAM, NAND and
NOR flash memory, as well as other innovative memory technologies,
packaging solutions and semiconductor systems for use in leading-edge
computing, consumer, networking, embedded and mobile products. Micron's
common stock is traded on the NASDAQ under the MU symbol. To learn more
about Micron Technology, Inc., visit www.micron.com.

The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950

(C)2012 Micron Technology, Inc. All rights reserved. Information is
subject to change without notice. Micron and the Micron orbit logo are
trademarks of Micron Technology, Inc. This news release contains
forward-looking statements regarding the production of DDR3. Actual
events or results may differ materially from those contained in the
forward-looking statements. Please refer to the documents Micron files
on a consolidated basis from time to time with the Securities and
Exchange Commission, specifically Micron's most recent Form 10-K and
Form 10-Q. These documents contain and identify important factors that
could cause the actual results for Micron on a consolidated basis to
differ materially from those contained in our forward-looking
statements (see Certain Factors). Although we believe that the
expectations reflected in the forward-looking statements are
reasonable, we cannot guarantee future results, levels of activity,
performance or achievements.


CONTACT: Mary Ellen Ynes
         maryellen.ynes@zenogroup.com
         650-801-7954