ARM, HP and SK hynix Join Collaboration for Hybrid Memory
                       Cube (HMC) Technology

BOISE, Idaho, June 27, 2012 (GLOBE NEWSWIRE) -- The Hybrid Memory Cube
Consortium (HMCC), led by Micron Technology (Nasdaq:MU) and Samsung
Electronics Co., Ltd., today announced that new members ARM, HP, and SK
hynix, Inc. have joined the global effort to accelerate widespread
industry adoption of Hybrid Memory Cube (HMC) technology. The HMCC is a
collaboration of original equipment manufacturers (OEMs), enablers and
integrators who are cooperating to develop and implement an open
interface standard for the innovative new memory technology.

Micron and Samsung, the initial developing members of the HMCC, are
working closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and
now ARM, HP and SK hynix -- to draft an industry-wide specification
that should pave the way for a wide range of electronic advances.

"The strong collection of companies who have joined the consortium --
representing a broad range of technology interests -- reflects the
perceived high value of HMC as the next standard for high-performance
memory applications," said Robert Feurle, Micron's vice president for
DRAM marketing. "With the addition of ARM, HP and SK hynix as
developers, who will help to determine the specific features, the
consortium is well positioned to provide a new open standard for
next-gen electronics."

HMC features will enable highly efficient memory solutions for
applications ranging from industrial products to high-performance
computing and large-scale networking. The HMCC's team of developers
plans to deliver a draft interface specification to the growing number
of "adopters" joining the consortium. Then, the combined team of
developers and adopters will refine the draft and release a final
interface specification, currently targeted for the end of this year.

As envisioned, HMC capabilities will leap beyond current and near-term
memory architectures in the areas of performance, packaging and power
efficiencies, offering a major alternative to present memory
technology.

One of the primary challenges facing the industry -- and a key
motivation for forming the HMCC -- is that the memory bandwidth
required by high-performance computers and next-generation networking
equipment has increased beyond what conventional memory architectures
can provide. The term "memory wall" has been used to describe this
challenge. Breaking through the memory wall requires architecture such
as HMC that can provide increased density and bandwidth with
significantly lower power consumption.

Adopter membership in the HMCC is available to any company interested
in joining the consortium and participating in the specification
development. Already, the HMCC has responded to interest from more than
90 prospective adopters.

Additional information, technical specifications, tools and support for
adopting the technology can be found at www.hybridmemorycube.org.

About the HMCC

Founded by leading members of the world's semiconductor community, the
Hybrid Memory Cube Consortium (HMCC) is dedicated to the development
and establishment of an industry-standard interface specification for
the Hybrid Memory Cube technology. Members of the consortium include
Altera, ARM, HP, IBM, SK hynix, Micron, Microsoft, Open-Silicon,
Samsung, and Xilinx. More than 90 prospective adopters are exploring
consortium membership. To learn more about the HMCC, visit
www.hybridmemorycube.org.


CONTACT: Scott Stevens
         Micron Technology, Inc.
         +1.512.288.4050
         sstevens@micron.com
         
         John Lucas
         Samsung Electronics Co., Ltd.
         408-544-4363
         j.lucas@ssi.samsung.com